Epoxies Etc... Flexible Eposy Resin Potting Compound 20-3241

Description
20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.
Datasheet
Description
20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.
Datasheet

Suppliers

Company
Product
Description
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Cranston, RI, USA
Flexible Eposy Resin Potting Compound
20-3241
Flexible Eposy Resin Potting Compound 20-3241
20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.

20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Encapsulants and Potting Compounds
Product Number 20-3241
Product Name Flexible Eposy Resin Potting Compound
Form / Function Liquid
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Filled
Industry Electronics; OEM or Industrial
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