Epoxies Etc... Single Component Thermally Conductive 50-3120

Description
50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
Datasheet

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Single Component Thermally Conductive - 50-3120 - Epoxies Etc...
Cranston, RI, USA
Single Component Thermally Conductive
50-3120
Single Component Thermally Conductive 50-3120
50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.

50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Industrial Adhesives
Product Number 50-3120
Product Name Single Component Thermally Conductive
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Filled
Features Thermally Conductive
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