Epoxies Etc... Epoxy Potting and Encapsulating Resin 20-3220

Description
20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.
Datasheet
Description
20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.
Datasheet

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Epoxy Potting and Encapsulating Resin - 20-3220 - Epoxies Etc...
Cranston, RI, USA
Epoxy Potting and Encapsulating Resin
20-3220
Epoxy Potting and Encapsulating Resin 20-3220
20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.

20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Encapsulants and Potting Compounds
Product Number 20-3220
Product Name Epoxy Potting and Encapsulating Resin
Form / Function Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Filled
Industry Electronics
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