Epoxies Etc... Epoxy Adhesive & Potting Compound 10-3009

Description
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
Datasheet
Description
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Epoxy Adhesive & Potting Compound - 10-3009 - Epoxies Etc...
Cranston, RI, USA
Epoxy Adhesive & Potting Compound
10-3009
Epoxy Adhesive & Potting Compound 10-3009
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Industrial Adhesives
Product Number 10-3009
Product Name Epoxy Adhesive & Potting Compound
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Unfilled
Type / Form Liquid
Features High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
Unlock Full Specs
to access all available technical data

Similar Products

Ellsworth E-CAST 207-1 Epoxy Adhesive Light Gray 50 mL Cartridge - E-CAST 207-1 50ML CARTRDGE - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Substrate Compatibility Metal; Paper or Paperboard; Plastic
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Formulations - Applications - Bonding - Tuffbond 313 - 3313AB22 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Ceramic
Features Encapsulant, Potting Compound
View Details
Medical Grade, Silver Conductive Epoxy Compound - EP21TDCSMed - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy; Polyurethane
Composition Filled
View Details