The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices.
The 20-2135 has outstanding thermal cycling properties, a low glass transition temperature and low embedment stress to sensitive electronic components. This system will maintain its’ integrity over a wide operating temperature range, -50°C to 120°C. It’s low glass transition temperature of -55°C makes it an ideal choice for low temperature potting applications.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 20-2135 |
| Product Name | Flexible polyurethane potting & encapsulating compound |
| Type | High Dielectric |
| Cure / Technology | Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Polyurethane |
| Features | Flexible |
| Industry | Electronics |
