Epoxies Etc... Flexible polyurethane potting & encapsulating compound 20-2135

The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling properties, a low glass transition temperature and low embedment stress to sensitive electronic components. This system will maintain its’ integrity over a wide operating temperature range, -50°C to 120°C. It’s low glass transition temperature of -55°C makes it an ideal choice for low temperature potting applications.