Epoxies Etc... Potting and Encapsulating Resin 20-3065

Description
20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
Datasheet

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Potting and Encapsulating Resin - 20-3065 - Epoxies Etc...
Cranston, RI, USA
Potting and Encapsulating Resin
20-3065
Potting and Encapsulating Resin 20-3065
20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.

20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Encapsulants and Potting Compounds
Product Number 20-3065
Product Name Potting and Encapsulating Resin
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Filled
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