20-3290 is a high temperature two part epoxy system. This system has low thermal coefficient of expansion, good thermal shock resistance and high temperature service. 20-3290 is used in a wide variety of electronic potting and encapsulating applications.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 20-3290 |
| Product Name | Potting, Encapsulating & Casting Epoxy |
| Form / Function | Liquid |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Composition | Unfilled |
