20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting, casting, and bonding applications.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 20-3061 |
| Product Name | Epoxy Resin System |
| Type | High Dielectric; Thermal Insulation |
| Form / Function | Liquid |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Epoxy |
| Composition | Filled |
