Epoxies Etc... Datasheets for Polyurethane Adhesives and Sealants
Polyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part systems.
Polyurethane Adhesives and Sealants: Learn more
| Product Name | Notes |
|---|---|
| 10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding and laminating. It may also be used to impregnate glass cloth and create a pipe repair system. FEATURES:... | |
| 20-2024 is a low viscosity, two component, closed cell urethane foam. This is a rigid, non-CFC containing foam. 20-2024 can be used for potting, encapsulating, thermal insulation, flotation devices, sandwich... | |
| 20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. | |
| 20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self... | |
| 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100... | |
| 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does... | |
| 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. | |
| 20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries... | |
| 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would... | |
| 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries... | |
| 20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20-... | |
| 20-2354 R is a two component, low durometer, potting, casting, and encapsulating compound. This unfilled system provides excellent hydrolytic stability and low moisture permeability. It has outstanding thermal cycling properties,... | |
| 20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate... | |
| 20-2362 has been formulated to meet the stringent non-burning requirements of UL94 VO. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has... | |
| 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm,... | |
| 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system... | |
| 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. | |
| 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound. | |
| 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system... | |
| 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm,... | |
| 50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low... | |
| 70-2170 is a liquid, low viscosity, urethane resin formulated for casting dimensionally stable parts. Parts cast with 70-2170 have an ABS feel and appearance. 70-2170 is mercury free and does... | |
| 70-2800 Polyurethane Elastomer Series are a line of high performance urethane prepolymers based on menthane diisocyanate, MDI. They do not contain MOCA or TDI. 70-2800 Urethanes are very low in... | |
| The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these... | |
| The 10-2080 and 10-2080 HV were developed to produce a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these... | |
| The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate... | |
| The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. | |
| The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer,... | |
| The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. | |
| This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel... | |
| This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. | |
| UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to... | |
| UV 60-7160 is a one component, UV light curable, clear coating. 60-7160 is water clear and exhibits superior yellowing resistance. This product has been formulated to cure instantly when exposed... | |
| UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain... | |
| UV Cure 60-7107 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). | |
| UV Cure 60-7108 is a low viscosity and optically clear UV curable system. It is designed for fiber optic and other clear adhesive or potting applications. UV Cure 60-7108 is... | |
| UV Cure 60-7111 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure... | |
| UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good... | |
| UV Cure 60-7156 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7156 is water clear and is designed to be... | |
| UV Cure 60-7158 is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. UV... | |
| UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB's), components and various substrates. When exposed to long wave UV it forms a tough, clear and... |