20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties.
20-2145 has very good adhesion to most substrates, low exotherm during cure, low internal stress and minimal shrinkage. It is an excellent choice for potting and encapsulating electronic modules, coils, and micro electronic networks that require thermal cycling extremes and low pressure on delicate components.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 20-2145R |
| Product Name | Polyurethane potting & encapsulating compound |
| Type | High Dielectric; Thermally Conductive |
| Cure / Technology | Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Polyurethane |
| Composition | Unfilled |
| Industry | Electronics |
