20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components.
| Epoxies Etc... | |
|---|---|
| Product Category | Rubber Adhesives and Sealants |
| Product Number | 20-2353 |
| Product Name | PU Potting & Encapsulating Compound |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Composition | Unfilled |
| Type / Form | Liquid |
| Features | Flexible; High Dielectric; Encapsulant, Potting Compound |
| Industry | Electronics |
