Epoxies Etc... Potting and Encapsulating Epoxy Resin 20-3060FR

Description
20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
Datasheet
Description
20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
Datasheet

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Potting and Encapsulating Epoxy Resin - 20-3060FR - Epoxies Etc...
Cranston, RI, USA
Potting and Encapsulating Epoxy Resin
20-3060FR
Potting and Encapsulating Epoxy Resin 20-3060FR
20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.

20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Encapsulants and Potting Compounds
Product Number 20-3060FR
Product Name Potting and Encapsulating Epoxy Resin
Type High Dielectric; Thermal Insulation
Form / Function Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Filled
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