Epoxies Etc... Epoxy Potting and Encapsulating Compound 20-3650

Description
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat.
Datasheet
Description
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat.
Datasheet

Suppliers

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Supplier Links
Epoxy Potting and Encapsulating Compound - 20-3650 - Epoxies Etc...
Cranston, RI, USA
Epoxy Potting and Encapsulating Compound
20-3650
Epoxy Potting and Encapsulating Compound 20-3650
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat.

20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Encapsulants and Potting Compounds
Product Number 20-3650
Product Name Epoxy Potting and Encapsulating Compound
Type High Dielectric; Thermal Insulation
Form / Function Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Filled
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