Epoxies Etc... Datasheets for Thermoset Adhesives
Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more
| Product Name | Notes |
|---|---|
| 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with... | |
| 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable... | |
| 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and... | |
| 10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS... | |
| 10-3006 is a new non-sag fast setting patch & repair epoxy system. This material has a convenient 1:1 mix ratio and will not run when used on vertical surfaces. 10-3006... | |
| 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of... | |
| 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product... | |
| 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance. | |
| 10-3018 is a two component epoxy adhesive and sealant. This two component system has excellent chemical and heat resistance. 10-3018 is widely used as a stencil and screen adhesive due... | |
| 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to... | |
| 10-3026 is a clear, fast setting epoxy resin system. This product forms a semi-flexible and strong bond to metals, pewter, glass, ceramic, felt, concrete, etc. 10-3026 does not contain any... | |
| 10-3031 is a two component electronic grade epoxy system. This material provides excellent chemical and heat resistance. It is available in a standard and low viscosity. | |
| 10-3032R is a high bond strength epoxy adhesive and sealant. This system has a non-critical mix ratio and adjustable flexibility. 10-3032R is also safe to use due to the absence... | |
| 10-3033 is a room temperature curing, two component, epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products... | |
| 10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day... | |
| 10-3039 is a room temperature curing, two component epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products... | |
| 10-3044 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3044 is widely used as a stencil and screen adhesive due to... | |
| 10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can... | |
| 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with... | |
| 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch... | |
| 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high... | |
| 10-3217 is a toughened, flexible, and impact resistant epoxy adhesive that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3217 is... | |
| 10-3507 is a two component, solvent free, underwater curing epoxy system. This system was formulated for applications requiring high adhesion to wet, cold or underwater surfaces. Kevlar has been added... | |
| 10-3508 is a steel filled repair and filling epoxy compound. This non-sag formulation will not drip on vertical surfaces and provides outstanding adhesion to metals, wood, concrete, glass and plastics. | |
| 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary... | |
| 10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55°C to 150°C). A unique and popular feature... | |
| 10-3792 is a unique one-component epoxy. It is a single component product which provides shock and impact resistance at elevated temperatures. | |
| 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and... | |
| 20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates. | |
| 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a... | |
| 20-3062 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. Both the 20-3062 and 20-3062 LV, (Low Viscosity version of 20-3062), meet the Food and... | |
| 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness... | |
| 20-3068 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. The 20-3068 meets the Food and Drug Administration (FDA) regulations permitting use in food contact... | |
| 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound. | |
| 20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix... | |
| 20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with... | |
| 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of... | |
| 40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. | |
| 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity... | |
| 40-3916 is a two component, nickel filled, electrically conductive, epoxy adhesive. This system was developed to provide a good balance of low cost and high conductivity. 40-3916 is recommended for... | |
| 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester,... | |
| 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates... | |
| 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is... | |
| 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. | |
| 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high... | |
| 70-2800 Polyurethane Elastomer Series are a line of high performance urethane prepolymers based on menthane diisocyanate, MDI. They do not contain MOCA or TDI. 70-2800 Urethanes are very low in... | |
| 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is... | |
| 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. | |
| Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity. | |
| Epoxies, Etc... has formulated its adhesives to bond a wide range of substrates such as glass, metal, plastic, and wood. We have also designed these materials to accommodate a large... | |
| One component heat cure epoxy system. This is a fast curing material known for its low temperature cure and excellent adhesion. | |
| These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding... | |
| These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. |