Epoxies Etc... Datasheets for Epoxy Adhesives
Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Epoxy Adhesives: Learn more
| Product Name | Notes |
|---|---|
| 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with... | |
| 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable... | |
| 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and... | |
| 10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS... | |
| 10-3006 is a new non-sag fast setting patch & repair epoxy system. This material has a convenient 1:1 mix ratio and will not run when used on vertical surfaces. 10-3006... | |
| 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of... | |
| 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product... | |
| 10-3011 is a two component fast curing epoxy adhesive. This system provides a rapid cure in thin films and at low temperatures. | |
| 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance. | |
| 10-3014 is a low viscosity, single part anaerobic securing compound. 10-3014 is engineered for fitting and securing cylindrical metal assemblies. Fixturing usually takes place in 15 minutes. APPLICATIONS: 10-3014 is... | |
| 10-3016 is a two component epoxy adhesive and sealant. This system is a low viscosity and unfilled. It can be pigmented if required. | |
| 10-3018 is a two component epoxy adhesive and sealant. This two component system has excellent chemical and heat resistance. 10-3018 is widely used as a stencil and screen adhesive due... | |
| 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to... | |
| 10-3026 is a clear, fast setting epoxy resin system. This product forms a semi-flexible and strong bond to metals, pewter, glass, ceramic, felt, concrete, etc. 10-3026 does not contain any... | |
| 10-3031 is a two component electronic grade epoxy system. This material provides excellent chemical and heat resistance. It is available in a standard and low viscosity. | |
| 10-3032R is a high bond strength epoxy adhesive and sealant. This system has a non-critical mix ratio and adjustable flexibility. 10-3032R is also safe to use due to the absence... | |
| 10-3033 is a room temperature curing, two component, epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products... | |
| 10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day... | |
| 10-3039 is a room temperature curing, two component epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products... | |
| 10-3044 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3044 is widely used as a stencil and screen adhesive due to... | |
| 10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can... | |
| 10-3056 is a general purpose two part epoxy adhesive and potting compound. This system is solvent free and bonds to a variety of substrates. 10-3056 provides excellent toughness and moisture... | |
| 10-3070 is a two component 100% solids epoxy adhesive and coating. 10-3070 is a non-sag, thixotropic system developed for applications requiring low temperature cures on damp or underwater substrates. This... | |
| 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with... | |
| 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch... | |
| 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high... | |
| 10-3217 is a toughened, flexible, and impact resistant epoxy adhesive that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3217 is... | |
| 10-3445 is a two component epoxy adhesive designed to offer both high shear and peel strength. It does not contain any solvents and offers a fast room temperature cure. | |
| 10-3507 is a two component, solvent free, underwater curing epoxy system. This system was formulated for applications requiring high adhesion to wet, cold or underwater surfaces. Kevlar has been added... | |
| 10-3508 is a steel filled repair and filling epoxy compound. This non-sag formulation will not drip on vertical surfaces and provides outstanding adhesion to metals, wood, concrete, glass and plastics. | |
| 10-3705 is a two component, solvent free, underwater curing epoxy system. This system was formulated for applications requiring high adhesion to wet, cold or underwater surfaces. Kevlar has been added... | |
| 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary... | |
| 10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55°C to 150°C). A unique and popular feature... | |
| 10-3792 is a unique one-component epoxy. It is a single component product which provides shock and impact resistance at elevated temperatures. | |
| 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and... | |
| 20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates. | |
| 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a... | |
| 20-3005 is a two component chemical resistance epoxy system. It was developed for potting, coating, and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of... | |
| 20-3062 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. Both the 20-3062 and 20-3062 LV, (Low Viscosity version of 20-3062), meet the Food and... | |
| 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness... | |
| 20-3068 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. The 20-3068 meets the Food and Drug Administration (FDA) regulations permitting use in food contact... | |
| 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound. | |
| 20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix... | |
| 20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with... | |
| 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of... | |
| 40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. | |
| 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity... | |
| 40-3916 is a two component, nickel filled, electrically conductive, epoxy adhesive. This system was developed to provide a good balance of low cost and high conductivity. 40-3916 is recommended for... | |
| 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester,... | |
| 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates... | |
| 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is... | |
| 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. | |
| 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high... | |
| 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is... | |
| 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. | |
| ALUMINUM FILLED EPOXY | |
| Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity. | |
| Epoxies, Etc... has formulated its adhesives to bond a wide range of substrates such as glass, metal, plastic, and wood. We have also designed these materials to accommodate a large... | |
| One component heat cure epoxy system. This is a fast curing material known for its low temperature cure and excellent adhesion. | |
| These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding... | |
| These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. | |
| UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be... | |
| UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is... | |
| UV Cure 60-7158 is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. UV... | |
| UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be... |