Epoxies Etc... PU Potting & Encapsulating System 20-2355

Description
20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate for the potting of sensitive and delicate electronic components. 20-2355 has a convenient mix ratio and excellent dielectric properties.
Datasheet

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PU Potting & Encapsulating System - 20-2355 - Epoxies Etc...
Cranston, RI, USA
PU Potting & Encapsulating System
20-2355
PU Potting & Encapsulating System 20-2355
20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate for the potting of sensitive and delicate electronic components. 20-2355 has a convenient mix ratio and excellent dielectric properties.

20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate for the potting of sensitive and delicate electronic components. 20-2355 has a convenient mix ratio and excellent dielectric properties.

Datasheet

Technical Specifications

  Epoxies Etc...
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number 20-2355
Product Name PU Potting & Encapsulating System
Chemical System Elastomeric; Polyurethane
Type / Form Liquid
Composition Unfilled
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Features Flexible; High Dielectric; Encapsulant, Potting Compound
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