50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
Epoxies Etc... | |
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Product Category | Encapsulants and Potting Compounds |
Product Number | 50-3185 Catalyst #140 |
Product Name | Thermally Conductive Resin |
Type | High Dielectric; Thermally Conductive |
Form / Function | Liquid |
Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
Chemical System | Epoxy |
Composition | Filled |