Epoxies Etc... Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Non-sag epoxy adhesive -- 10-3003NS 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and...
Elastomeric potting & encapsulating compound -- 20-2121 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does...
Elastomeric potting & encapsulating compound -- 20-2125 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does...
Polyurethane potting & encapsulating compound -- 20-2145R 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties.
Urethane sealant, adhesive & potting compound -- 20-2162 20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries...
Polyurethane potting compound -- 20-2175 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would...
Urethane sealant, adhesive & potting compound -- 20-2182 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries...
Thermally Conductive PU Potting Compound -- 20-2366FR 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system...
Epoxy potting and encapsulating resin -- 20-3001NC 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that...
Epoxy resin -- 20-3652 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to...
Low viscosity epoxy resin -- 20-3652-40 20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties.
High temperature epoxy resin system -- 20-3660R 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
Thermally Conductive Silicone Rubber -- 50-1225 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
Thermally Conductive PU Potting Compound -- 50-2366 FR 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system...
Thermally conductive polyurethane potting compound -- 50-2368FR 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm,...
Fast Gelling Polyurethane Compound -- 50-2370 50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low...
High Thermal K Heat Transfer Epoxy -- 50-3100 FR 50-3100 FR is designed for the fastest and most continuous high heat transfer. 50-3100 FR measures several times faster heat dissipation than other commercially available types. The most important breakthrough...
High Thermal K Heat Transfer Epoxy -- 50-3100 50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the...
Low Viscosity Epoxy RoHS -- 50-3107 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and...
One Component MicroElectric Grade Epoxy -- 50-3115 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance...
Single Component Thermally Conductive -- 50-3120 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates...
Electrically Insulating Epoxy Adhesive -- 50-3122 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is...
Flame Retardant Thermally Conductive -- 50-3150 FR 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for...
Flame Retardant Thermally Conductive -- 50-3151 FR 50-3151 FR has been formulated to meet the stringent non-burning requirements of UL 94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151 FR is...
Thermally Conductive Epoxy Resin -- 50-3155 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination...
Thermally Conductive Epoxy -- 50-3170 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
Thermally Conductive Epoxy -- 50-3182 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination...
Thermally Conductive Resin -- 50-3185 Catalyst #105
Thermally Conductive Resin -- 50-3185 Catalyst #140
Thermally Conductive Resin -- 50-3185 Catalyst #190
50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is...
High Temperature Resistant Epoxy -- 50-3186 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high...
Aluminum filled epoxy system -- 70-3800R 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is...
High thermal transfer epoxy -- 70-3811 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance.
55 Shore D polyurethane adhesive -- 10-2055 The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these...
80-Shore D polyurethane adhesive -- 10-2080 The 10-2080 and 10-2080 HV were developed to produce a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these...
Flame retardant thermally conductive polyurethane -- 50-2150FR The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties.
Flame retardant thermally conductive polyurethane -- 50-2185FR The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer,...
Flame Retardant Polyurethane -- 50-2369 FR The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O.