50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 50-3185 Catalyst #190 |
| Product Name | Thermally Conductive Resin |
| Type | High Dielectric; Thermally Conductive |
| Form / Function | Liquid |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Epoxy |
| Composition | Filled |
