20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.
| Epoxies Etc... | |
|---|---|
| Product Category | Rubber Adhesives and Sealants |
| Product Number | 20-2366FR |
| Product Name | Thermally Conductive PU Potting Compound |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Composition | Unfilled |
| Type / Form | Liquid |
| Features | Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive; UL Rating |
| Industry | Electronics |
