Aries Electronics, Inc. Datasheets for IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more
| Product Name | Notes |
|---|---|
| Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342 FEATURES Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors Allows user to switch package... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Pressure mounting, no soldering required... | |
| Available with or without filters for UV, infrared and full spectrum applications, Aries’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing... | |
| EATURES A choice of 24-, 28-, or 40-pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove... | |
| EATURES Makes 48-pin QFP prototype circuits with a standard breadboard easy GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard per UNS... | |
| FEATURES 44-pin Adapter for mounting Universal SOIC ZIF Test Socket to 0.600 [15.24] DIP PCB layout GENERAL SPECIFICATIONS BODY MATERIAL: black 0.062 [1.58] thick FR-4 or IS410 per IPCA4101A/26, 0.094... | |
| FEATURES 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted... | |
| FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be... | |
| FEATURES A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or... | |
| FEATURES A cost-effective means of upgrading to PLCC package without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC to DIP without changing your PCB layout Available on 0.400 [10.16] and 0.600 [15.24] centers For Adapters on 0.300 [7.62]... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout Available on 0.300 [7.62] centers For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult... | |
| FEATURES A cost-effective solution for design problems, this socket reroutes connections from a row of female contacts on top to the opposite row of male pins on bottom ICs can... | |
| FEATURES A lead-free RoHS/WEEE-compliant cost-effective adapter to upgrade DIP-to-SOIC on 0.300" [7.62] centers without changing your PCB layout. GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous... | |
| FEATURES A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force The handle can be provided on right or left hand side For special handle... | |
| FEATURES Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm Features raised connection pads up to 0.010 [0.25] Available in tape-and-reel for high-speed surface-mount technology... | |
| FEATURES Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24]... | |
| FEATURES Allows easy replacement of a difficult-to-find part GENERAL SPECIFICATIONS PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN... | |
| FEATURES Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards Solder masked top-side pads allow user... | |
| FEATURES Allows placing an PLCC package on a board laid out for a shrink DIP GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides PADS:... | |
| FEATURES Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end user For... | |
| FEATURES Allows the use of a narrow package IC in place of a wide one GENERAL SPECIFICATIONS LEADS: mechanically fastened and soldered to adapter’s PCB substrate PCB: FR-4, 0.062 [1.56]... | |
| FEATURES Allows the use of a wide package IC in place of a narrow one GENERAL SPECIFICATIONS LEADS: mechanically fastened to PCB as well as soldered PCB: FR-4, 0.062 [1.56]... | |
| FEATURES Any grid size pitch available from 0.20mm Socket lid nests device into socket for a reliable connection Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA... | |
| FEATURES Aries DIP Programmable Headers offer unusual versatility for programming within the header itself They can be individually programmed using cutters or Aries programming tool, P/N T-675, available separately, to... | |
| FEATURES Aries offers a full line of DIP Headers, available with either Coined or Screw Machine Contacts For Screw Machine Contacts, consult Data Sheet 12035 Snap-on, Protective Covers are available... | |
| FEATURES Aries offers a full line of DIP Headers, available with either screw machine or coined contacts in a variety of styles For Coined Contacts, consult Data Sheet 12032 GENERAL... | |
| FEATURES Aries offers a full line of DIP Sockets for packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting position and pin configuration provide exceptional design... | |
| FEATURES Aries offers a full line of Horizontal Display DIP Sockets for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting position and pin configuration... | |
| FEATURES Aries offers a full line of Vertisocket™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting positions provide exceptional design freedom Accepts standard... | |
| FEATURES Aries offers a full line of Vertisockets™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting positions provide exceptional design freedom Accepts standard... | |
| FEATURES Aries offers a wide number of pin grid array configurations from which to choose Low-insertion-force contacts standard GENERAL SPECIFICATIONS PGM SERIES SOCKET BODY: black UL 94V-0 glass-filled 4/6 Nylon... | |
| FEATURES Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24]... | |
| FEATURES Capacitor bypasses unwanted electromagnetic noise Available with either 0.1µF or 0.33µF capacitor, 50V, Z5U temperature coefficient Open frame allows for more efficient utilization of board space and better cooling... | |
| FEATURES Complete versatility for programming within the unit itself, thus eliminating the need for DIP switches in many situations. Available pre-programmed from Aries, or do-it-yourself using Aries Hand Tool P/N... | |
| FEATURES Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp PCB: FR-4, 0.062... | |
| FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4,... | |
| FEATURES Convert surface-mount QFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Convert surface-mount QFP packages to a 15x15 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Convert surface-mount QFP packages to a 17x17 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Converts PLCC packaged ICs to DIP footprints Ideal for prototyping and testing/evaluation Available with PLCC sockets or PLCC pads on top side For Panelized Form or for mounting of... | |
| FEATURES Converts PLCC packaged ICs-to-DIP footprints Ideal for prototyping and testing/evaluation Available with PLCC Sockets or PLCC Pads on top side For Panelized Form or for mounting of consigned ICs,... | |
| FEATURES Correct-A-Chip® technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs GENERAL SPECIFICATIONS... | |
| FEATURES Correct-A-Chip® technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs Available... | |
| FEATURES Designed to allow user to cut 32-position adapter down to any size desired Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical... | |
| FEATURES Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from... | |
| FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high vibration... | |
| FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high-vibration environments... | |
| FEATURES For elevated mounting of LCDs and other odd-centered or high pin count components Any height from 0.360 to 2.000 [9.14 to 50.80] Optional spacer available for mounting on 0.300... | |
| FEATURES For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures scrub on solder oxides, while pointed probe works... | |
| FEATURES For mounting components, jumpers, etc., at right angle to PC board Available in 1 to 25 positions; cuttable to any number desired GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0... | |
| FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins... | |
| FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in wire wrap pins or solder pin tails... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm 4-point crown insures “scrub” on... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Pressure mounting, no soldering required... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Socket is easily mounted and... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4 Point crown insures scrub on solder oxides Single-point Probes... | |
| FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single Point Probes... | |
| FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Pressure mounting, no soldering required 4 Point crown (other... | |
| FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Socket is easily mounted and removed to & from... | |
| FEATURES For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any pitch device from 0.20mm Socket is easily mounted and removed to & from... | |
| FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.240 to 1.250 [6.10 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: Spacer black UL 94V-0 glass-filled... | |
| FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.260 to 1.250 [6.60 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: black UL 94V-0 glass-filled 4/6... | |
| FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.285 to 1.250 [7.24 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: and Spacer black UL 94V-0... | |
| FEATURES Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the... | |
| FEATURES Lead-Free RoHs/WEEE-compliant 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can... | |
| FEATURES Lead-free RoHS/WEEE-compliant A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-406 or IS410 per... | |
| FEATURES Lead-Free RoHS/WEEE-Compliant A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult... | |
| FEATURES Lead-Free RoHS/WEEE-compliant A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout Available on 0.400 [10.16] and 0.600 [15.24] centers For Adapters on 0.300 [7.62]... | |
| FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed... | |
| FEATURES Low-Profile Collet Sockets with Solder Pin Tails For Wire Wrap Pins, see Data Sheet 12012 Choose from several size and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0... | |
| FEATURES Low-Profile Collet Sockets with Wire Wrap Pins For Solder Pin Tails, consult Data Sheet 12011 Choose from several sizes and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0... | |
| FEATURES Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping Panelized adapters available upon request GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL... | |
| FEATURES Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping Panelized adapters available upon request GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58]... | |
| FEATURES Open Frame allows efficient utilization of board space with optimized cooling Choose from several pin styles Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL SPECIFICATIONS BODY MATERIAL:... | |
| FEATURES Open-frame allows for more efficient utilization of board space and better cooling 2- and 3-level wire wrap pins available Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL... | |
| FEATURES Open-frame allows for more efficient utilization of board space and better cooling Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled... | |
| FEATURES Pin-Line™ Headers are available with a variety of screw machined contacts For Strip-Line™ Headers with coined contacts, consult Data Sheet 12034 Break feature allows header to be cut to... | |
| FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual... | |
| FEATURES Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other... | |
| FEATURES Replace difficult-to-obtain PLCC devices with common DIP packages GENERAL SPECIFICATIONS PCB: FR-4, 0.062 [1.56 or 0.094 [2.39] thick MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M OPERATING... | |
| FEATURES RoHS/WEEE-Compliant Allows the use of 0.65mm pitch surface mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end... | |
| FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with solder pin tails or... | |
| FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with wire wrap or solder... | |
| FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use... | |
| FEATURES Standard DIP Sockets are available with Solder Pin Tails or Wire Wrap Pins, both with bifurcated contacts Aries offers these standard DIP sockets in more sizes than any other... | |
| FEATURES Strip-Line™ Headers are available with either fork or post style coined contacts For Pin-Line™ Headers with screw machine contacts, consult Data Sheet 12036 Break feature allows header to be... | |
| FEATURES Surface-mount collet sockets are available in single and dual row Break feature allows strips to be cut to the number of positions desired Compatible with automatic insertion equipment Side-to-side... | |
| FEATURES The Aries Universal Test Socket Receptacle is sturdy, open-frame and easily mounted to PC boards Allows for easy replacement of Aries and other manufacturers’ test sockets The threaded inserts... | |
| FEATURES These low-cost DIP Sockets are recommended for high-volume vertical display mounting applications Useful for connection of board-to-board jumpers, DIP switches, and LED devices GENERAL SPECIFICATIONS STANDARD BODY MATERIAL: black... | |
| FEATURES This 4-pin Oscillator Socket (in 14- and 8-position frames) accept standard oscillator packages Designed to be end-to-end or side-to-side stackable Machine insertable GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0... | |
| FEATURES This Universal PLCC ZIF Test Socket takes seven sizes of PLCC footprints with Aries Insert Plates The PLCC is inserted ‘live bug’ (pins down) into the position over the... | |
| FEATURES Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers... | |
| FEATURES Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to... | |
| FEATURES User replaceable patented Microstrip™ contacts which lie flat on the DUT board, and become part of the transmission line decreasing down-time Same high-frequency performance of our standard Microstrip™ contacts... | |
| FEATURES User replaceable patented Microstrip™ contacts which lie flat on the DUT board, and becomes part of the transmission line decreasing down-time Same high-frequency performance of our standard Microstrip™ contacts... | |
| KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables... | |
| KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice... | |
| CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for... | |
| High-Frequency Center Probe Test Socket for Devices up to 27mm Square Chinese FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device... |
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