Aries Electronics, Inc. EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Surface Mount Pins

FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high vibration environments The latch, when used as an ejector, removes DIP packages without pin damage High-temperature 4/6 Nylon suitable for virtually any surface-mount soldering application GENERAL SPECIFICATIONS LATCH AND BODY: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 6-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM-B194-01 CONTACT PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B. Heavy 30µ [0.76µ] Au plating on contact also available CONTACT CURRENT RATING: 3 amps INSULATION RESISTANCE: 10,000 Mω @ 500 VDC WITHSTANDING VOLTAGE: 1000 V RMS OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn plating, -67°F to 257°F [-55°C to 125°C] Au INSERTION FORCE: 67g/pin, based on 0.018 [0.46] dia. test lead WITHDRAWAL FORCE: 30g/pin, based on 0.018 [0.46] dia. test lead NORMAL FORCE: 45g/pin, based on 0.018 [0.46] dia. test lead MOUNTING CONSIDERATIONS SUGGESTED PCB PAD SIZE: 0.063 [1.60] dia.