Aries Electronics, Inc. CSP/BallNest™Hybrid Socket

FEATURES Any grid size pitch available from 0.20mm Socket lid nests device into socket for a reliable connection Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe Special lid designs and/or materials can be quoted Socket easily located, mounted & removed from PCB Signal path during test only 0.077 [1.96] 4-point crown insures scrub on solder oxides – consult factory for other available probe styles The Au over Ni plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls GENERAL SPECIFICATIONS BODY MATERIAL: PEEK or TORLON 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe) ESTIMATED CONTACT LIFE: 500,000 cycles COMPRESSION SPRING-PROBES: heat-treated BeCu with 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min. [0.75µ] Ni per SAE AMS-QQ-N-290B CONTACT FORCE: : 15g per contact on 0.30-0.35mm pitch : 16g per contact on 0.40-0.45mm pitch : 25g per contact on 0.50-0.75mm pitch : 25g per contact on 0.80mm pitch or larger SCREWS, ALIGNMENT PINS: Stainless Steel INSERTS: Brass per QQ-B-626, Sn/plated OPERATING TEMPERATURE: -55ºC to 150ºC [-67º to 302º] MOUNTING CONSIDERATIONS NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB TEST PCB MINIMUM DIAMETER "G"... : 0.025 [0.64] (large probe 0.80mm pitch and larger) : 0.015 [0.38] (small probe 0.50-0.79mm pitch) : 0.012 [0.31] (small probe 0.40-0.49mm pitch) : 0.009 [0.23] (small probe 0.30-0.39mm pitch) : 0.004 [0.10] (small probe 0.20-0.29mm pitch) TEST PCB DIA. SPRING-PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB.