Aries Electronics, Inc.Universal SOIC ZIF Test Socket – Series 547
Description
FEATURES
Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket
Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to 0.600 [3.81 to 15.24]
Optional device lifter for easy package removal
GENERAL SPECIFICATIONS
BODY MATERIAL: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
CONTACTS: BeCu 172 per QQ-C-533
CONTACT PLATING: 20µ [0.51µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per QQ-N-290 over 20µ [0.51µ] min. Cu per MIL-C-14550
HARDWARE: Stainless Steel
CONTACT CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 257°F [125°C]
Aries Electronics, Inc.
Done
Datasheet
Description
FEATURES
Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket
Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to 0.600 [3.81 to 15.24]
Optional device lifter for easy package removal
GENERAL SPECIFICATIONS
BODY MATERIAL: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
CONTACTS: BeCu 172 per QQ-C-533
CONTACT PLATING: 20µ [0.51µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per QQ-N-290 over 20µ [0.51µ] min. Cu per MIL-C-14550
HARDWARE: Stainless Steel
CONTACT CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 257°F [125°C]
FEATURES
Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket
Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to 0.600 [3.81 to 15.24]
Optional device lifter for easy package removal
GENERAL SPECIFICATIONS
BODY MATERIAL: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
CONTACTS: BeCu 172 per QQ-C-533
CONTACT PLATING: 20µ [0.51µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per QQ-N-290 over 20µ [0.51µ] min. Cu per MIL-C-14550
HARDWARE: Stainless Steel
CONTACT CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 257°F [125°C]
FEATURES
Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket
Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to 0.600 [3.81 to 15.24]
Optional device lifter for easy package removal
GENERAL SPECIFICATIONS
BODY MATERIAL: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
CONTACTS: BeCu 172 per QQ-C-533
CONTACT PLATING: 20µ [0.51µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per QQ-N-290 over 20µ [0.51µ] min. Cu per MIL-C-14550
