Description
FEATURES
Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices
Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
The Au over Ni plated compression Spring-Probes leave very small witness marks on the bottom surface of the device pads
Small overall socket size/profile allows max. number of sockets per test board, while being operator-friendly
Kelvin Test Socket Contact System is available for any Aries CSP and Center Probe Test Sockets
Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
Probe blade edge tip for cutting through solder oxide layers
Signal path during test only 0.082 [2.08]
GENERAL SPECIFICATIONS
MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
MACHINED SOCKET COMPONENTS: UL 94V-0 PEEK or Torlon
ALL HARDWARE: Stainless Steel
COMPRESSION SPRING-PROBE: heat-treated BeCu
COMPRESSION SPRING-PROBE PLATING: 50µ min. [1.27µ] Au per MIL-G-45204 over 50µ min. [1.27µ] Ni per SAE AMS-QQ-N-290B
DURABILITY: 500,000 cycles min.
CONTACT FORCE: 16g/contact on 0.40-0.45mm pitch
OPERATING TEMPERATURE:-55°C [-67°F] min. to 150°C [302°F] max.
MOUNTING CONSIDERATIONS
See “PCB FOOTPRINT TOP VIEW” for requirements
REQUIRES: four #2-56 screws and PEM nuts for mounting (not supplied – mounting holes size shown may differ depending on PEM nut selected)
NOTE: Sockets must be handled with care when mounting or removing to/from test board to avoid damaging sensitive spring contacts
TEST PCB DIA. "G": 0.012 [0.31] (small probe 0.40-0.45mm pitch)
TEST PCB DIA. SPRING-PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB.
