FEATURES
Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping
Panelized adapters available upon request
GENERAL SPECIFICATIONS
BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces
PIN INSULATOR: Polyester, UL 94V-0
PINS: 360 1/2-hard per UNS C36000 ASTM-B16-00
PIN PLATING: Au Flash
OPERATING TEMPERATURE: -55°C to +125°C
Aries Electronics, Inc.
Done
Datasheet
Description
FEATURES
Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping
Panelized adapters available upon request
GENERAL SPECIFICATIONS
BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces
PIN INSULATOR: Polyester, UL 94V-0
PINS: 360 1/2-hard per UNS C36000 ASTM-B16-00
PIN PLATING: Au Flash
OPERATING TEMPERATURE: -55°C to +125°C
FEATURES
Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping
Panelized adapters available upon request
GENERAL SPECIFICATIONS
BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces
PIN INSULATOR: Polyester, UL 94V-0
PINS: 360 1/2-hard per UNS C36000 ASTM-B16-00
PIN PLATING: Au Flash
OPERATING TEMPERATURE: -55°C to +125°C
FEATURES
Mates common QFP packages to standard breadboard and breakout boards for rapid
and easy prototyping
Panelized adapters available upon request
GENERAL SPECIFICATIONS
BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces
