Aries Electronics, Inc. Datasheets for IC Package Converters and Adapters
IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets.
IC Package Converters and Adapters: Learn more
| Product Name | Notes |
|---|---|
| Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342 FEATURES Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors Allows user to switch package... | |
| Available with or without filters for UV, infrared and full spectrum applications, Aries’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing... | |
| EATURES Makes 48-pin QFP prototype circuits with a standard breadboard easy GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard per UNS... | |
| FEATURES 44-pin Adapter for mounting Universal SOIC ZIF Test Socket to 0.600 [15.24] DIP PCB layout GENERAL SPECIFICATIONS BODY MATERIAL: black 0.062 [1.58] thick FR-4 or IS410 per IPCA4101A/26, 0.094... | |
| FEATURES 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted... | |
| FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be... | |
| FEATURES A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. Available on 0.300 [7.62] centers GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. | |
| FEATURES A cost-effective means of upgrading to PLCC package without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360... | |
| FEATURES A cost-effective means of upgrading to QFP without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. RoHS Compliant Board FR406... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet... | |
| FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC to DIP without changing your PCB layout Available on 0.400 [10.16] and 0.600 [15.24] centers For Adapters on 0.300 [7.62]... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass... | |
| FEATURES A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout Available on 0.300 [7.62] centers For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult... | |
| FEATURES A cost-effective means of upgrading to SSOP without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard... | |
| FEATURES A lead-free RoHS/WEEE-compliant cost-effective adapter to upgrade DIP-to-SOIC on 0.300" [7.62] centers without changing your PCB layout. GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous... | |
| FEATURES Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm Features raised connection pads up to 0.010 [0.25] Available in tape-and-reel for high-speed surface-mount technology... | |
| FEATURES Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24]... | |
| FEATURES Allows easy replacement of a difficult-to-find part GENERAL SPECIFICATIONS PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN... | |
| FEATURES Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards Solder masked top-side pads allow user... | |
| FEATURES Allows placing an PLCC package on a board laid out for a shrink DIP GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides PADS:... | |
| FEATURES Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end user For... | |
| FEATURES Allows the use of a narrow package IC in place of a wide one GENERAL SPECIFICATIONS LEADS: mechanically fastened and soldered to adapter’s PCB substrate PCB: FR-4, 0.062 [1.56]... | |
| FEATURES Allows the use of a wide package IC in place of a narrow one GENERAL SPECIFICATIONS LEADS: mechanically fastened to PCB as well as soldered PCB: FR-4, 0.062 [1.56]... | |
| FEATURES Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions Allows user to switch package styles and avoid shortage problems Designed... | |
| FEATURES Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp PCB: FR-4, 0.062... | |
| FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4,... | |
| FEATURES Convert surface-mount PQFP packages to an Amp interstitial PGA footprint Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and... | |
| FEATURES Convert surface-mount QFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Convert surface-mount QFP packages to a 15x15 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Convert surface-mount QFP packages to a 17x17 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Convert surface-mount VQFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered... | |
| FEATURES Converts PLCC packaged ICs to DIP footprints Ideal for prototyping and testing/evaluation Available with PLCC sockets or PLCC pads on top side For Panelized Form or for mounting of... | |
| FEATURES Converts PLCC packaged ICs-to-DIP footprints Ideal for prototyping and testing/evaluation Available with PLCC Sockets or PLCC Pads on top side For Panelized Form or for mounting of consigned ICs,... | |
| FEATURES Correct-A-Chip® technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs GENERAL SPECIFICATIONS... | |
| FEATURES Designed to allow user to cut 32-position adapter down to any size desired Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical... | |
| FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Pressure mounting, no soldering required 4 Point crown (other... | |
| FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Socket is easily mounted and removed to & from... | |
| FEATURES For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any pitch device from 0.20mm Socket is easily mounted and removed to & from... | |
| FEATURES Lead-Free RoHs/WEEE-compliant 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can... | |
| FEATURES Lead-free RoHS/WEEE-compliant A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-406 or IS410 per... | |
| FEATURES Lead-Free RoHS/WEEE-Compliant A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult... | |
| FEATURES Lead-Free RoHS/WEEE-compliant A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout Available on 0.400 [10.16] and 0.600 [15.24] centers For Adapters on 0.300 [7.62]... | |
| FEATURES Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping Panelized adapters available upon request GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL... | |
| FEATURES Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping Panelized adapters available upon request GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58]... | |
| FEATURES Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other... | |
| FEATURES Replace difficult-to-obtain PLCC devices with common DIP packages GENERAL SPECIFICATIONS PCB: FR-4, 0.062 [1.56 or 0.094 [2.39] thick MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M OPERATING... | |
| FEATURES RoHS/WEEE-Compliant Allows the use of 0.65mm pitch surface mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end... | |
| FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use... | |
| GENERAL SPECIFICATIONS PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick PADS: bare Cu protected with Entek® by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges MALE... | |
| High-Frequency Center Probe Test Socket for Devices up to 27mm Square Chinese FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device... |