Aries Electronics, Inc. SSOP-to-DIP Adapter

Description
FEATURES Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end user For Panelized Form or for mounting of consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 200µ [5.08µ] min. Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] min. Au per MIL-G-4524 over 100µ [2.54] Ni per SAE AMS-QQ-N-290B CURRENT RATING: 1 amp OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard IC socket
Datasheet
Description
FEATURES Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end user For Panelized Form or for mounting of consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 200µ [5.08µ] min. Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] min. Au per MIL-G-4524 over 100µ [2.54] Ni per SAE AMS-QQ-N-290B CURRENT RATING: 1 amp OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard IC socket
Datasheet

Suppliers

Company
Product
Description
Supplier Links
SSOP-to-DIP Adapter -  - Aries Electronics, Inc.
Bristol, PA, USA
SSOP-to-DIP Adapter
SSOP-to-DIP Adapter
FEATURES Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs Ideal for prototyping and testing/evaluating SSOP ICs Adapter can be cut to smaller sizes by end user For Panelized Form or for mounting of consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 200µ [5.08µ] min. Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] min. Au per MIL-G-4524 over 100µ [2.54] Ni per SAE AMS-QQ-N-290B CURRENT RATING: 1 amp OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard IC socket

FEATURES

  • Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs
  • Ideal for prototyping and testing/evaluating SSOP ICs
  • Adapter can be cut to smaller sizes by end user
  • For Panelized Form or for mounting of consigned ICs, consult factory

GENERAL SPECIFICATIONS

  • ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 200µ [5.08µ] min. Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] min. Au per MIL-G-4524 over 100µ [2.54] Ni per SAE AMS-QQ-N-290B
  • CURRENT RATING: 1 amp
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
  • Will plug into standard IC socket
Supplier's Site Datasheet

Technical Specifications

  Aries Electronics, Inc.
Product Category IC Interconnect Components
Product Name SSOP-to-DIP Adapter
Product Type Package Adapters / Converters
Mounting Through-Hole
Current Rating 1 amps
Operating Temperature 105 C (221 F)
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