Aries Electronics, Inc. High-Temperature Universal DIP ZIF Test Socket – Series X55X

FEATURES Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact Socket handle can be configured with closed contacts (on) when in the UP or DOWN position, and can be mounted on either the right or left side Sockets can be soldered into PCBs or fit into Test Socket Receptacles GENERAL SPECIFICATIONS SOCKET BODY: natural UL 94V-0 glass-filled Polyetheretherketone (PEEK) HANDLE: Stainless Steel CONTACTS: BeNi 360, 1/2-hard CONTACT PLATING: 50µ [1.27µ] NiB CONTACT CURRENT RATING: 1 amp OPERATING TEMPERATURE: -55°C to 250°C (300°C special order) RETENTION FORCE (closed): 55 grams/pin based on a 0.020 [0.51] dia. test lead INSULATION RESISTANCE: 1000 Mω min. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC LIFE CYCLE: 25,000 to 50,000 cycles ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long