Aries Electronics, Inc. High-Frequency (RF) Interposer Socket

FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications GENERAL SPECIFICATIONS INSERTION LOSS: less than -1dB to 40GHz SOCKET BODY MATERIAL: specified at time of quotation INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side AVAILABLE PITCHES: down to 0.32mm CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP). VSWR <2:1 to 40GHz CONTACT RESISTANCE: <20mω CONTACT FORCE: 15-25 grams CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak) CONTACT LIFE: 50,000-100,000 SIGNAL PATH LENGTH: 0.011 (with compliant pads) MUTUAL CAPACITANCE: 0.015pF TEMPERATURE OPERATING RANGE: -40°C to 150°C MOUNTING CONSIDERATIONS SUGGESTED PCB PADS: Au-plated MOUNTING FORCE: 5-oz inches [0.035Nm]