Aries Electronics, Inc. Quick-Release Universal DIP ZIF Test Socket – Series X57X

FEATURES Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads Socket handle can be mounted on either the right or left side Sockets can be soldered into PCBs or plugged into any socket GENERAL SPECIFICATIONS STANDARD SOCKET BODY: (for -10, -10TL, -11, -16 sockets) black UL 94V-0 glassfilled Polyphenylene Sulfide (PPS) HIGH-TEMPERATURE SOCKET BODY: (for -18 socket) natural color Polyetheretherketone (PEEK) HANDLE: Stainless Steel HANDLE KNOB: Brass 360, 1/2-hard (no knob on loop handle) CONTACT MATERIAL: (for -10, -10TL, -11) BeCu 172 per QQ-C-553; (for -16) Spinodal; (for -18) BeNi 360, 1/2-hard BeCu CONTACTS: 50µ [1.27µ] min. Ni under plate per QQ-N-290, over plated with either: -10 200µ [5.08µ] min. matte Sn per ASTM B545-97; or -10TL 200µ [5.08µ] min. 90/10 Sn/Pb per MIL-T-10727-11 10µ [0.25µ] min. Au per MIL-G-45204 SPINODAL CONTACT PLATING: (for -16) 50µ [1.27µ] min. NiB HIGH-TEMPERATURE BeNi CONTACT PLATING: (for -18) 50µ [1.27µ] NiB CONTACT CURRENT RATING: 1 amp INSULATION RESISTANCE: 1000 Mω min. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC LIFE CYCLE: 25,000 to 50,000 cycles OPERATING TEMPERATURE: min. -67°F [-55°C]; max. 221°F [105°C] for Sn plating, 302°F [150°C] for Au plating, 392°F [200°C] for NiB plating, 482°F [250°C] for high-temperature socket RETENTION FORCE (closed): 55 grams/pin based on a 0.020 [0.51] dia. test lead ACCEPTS LEADS: 0.015-0.035 [0.38-0.89] wide, 0.110-0.280 [2.79-7.11] long