Aries Electronics, Inc. Series 354000 DIP-to-SOIC Adapter

FEATURES Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp PCB: FR-4, 0.062 [1.58] thick MALE ADAPTER PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 per ASTM B579-73 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290B FEMALE CONTACT PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/ B16M FEMALE PIN PLATING: 10μ [0.254μ] Au per MIL-G-45204 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290B 4-FINGER COLLET CONTACT: BeCu per UNS C17200, ASTM B194-08 FEMALE CONTACT PLATING: 10μ [0.254μ] Au per MIL-G-45204 over 50μ [1.27μ] Ni per SAE AMS-QQ-N- 290 CONTACT CURRENT RATING: 3 amps OPERATING TEMPERATURE: 221°F [105°C] INSERTION FORCE: 180g/pin; based on a 0.018 [0.46] dia. test lead WITHDRAWAL FORCE: 90g/pin; based on a 0.018 [0.46] dia. test lead NORMAL FORCE: 140g/pin; based on a 0.018 [0.46] dia. test lead SOCKET ACCEPTS LEADS: 0.015-0.025 [0.38-0.64] in dia., 0.100-0.125 [2.54-3.18] long MOUNTING CONSIDERATIONS SUGGESTED PCB SOLDER PAD SIZE: 0.028 [0.71] min. width