Aries Electronics, Inc. BGA Switch-A-Pitch™ Adapters

FEATURES Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements) Enable the use of standard line and trace spacing Eliminate the need for laser-drilled micro vias motherboards GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305 TRACE WIDTH/SPACE: 0.003 [0.0762] OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free MOUNTING CONSIDERATIONS SUGGESTED PCB PAD SIZE: 0.022 [0.559] for 1.27mm pitch; 0.020 [0.51] for 1.00mm pitch