Aries Electronics, Inc. PLCC-to-PGA Adapter

Description
FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces PADS: hot-air solder leveled PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 ASTM B579-73 over 100μ [2.54μ] Ni per ASE AMS-QQ-N-290 or 10μ [0.25μ] Au OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket
  • PLCC-to-PGA Adapter - Aries Electronics, Inc.
    Aries Electronics, Inc.
Datasheet
Description
FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces PADS: hot-air solder leveled PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 ASTM B579-73 over 100μ [2.54μ] Ni per ASE AMS-QQ-N-290 or 10μ [0.25μ] Au OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket
Datasheet

Suppliers

Company
Product
Description
Supplier Links
PLCC-to-PGA Adapter - - Aries Electronics, Inc.
Aries Electronics, Inc.
Bristol, PA, USA
PLCC-to-PGA Adapter
PLCC-to-PGA Adapter
FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces PADS: hot-air solder leveled PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 ASTM B579-73 over 100μ [2.54μ] Ni per ASE AMS-QQ-N-290 or 10μ [0.25μ] Au OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket

FEATURES

  • Convert surface-mount PLCC packages to a PGA footprint
  • Pin polarization option also available
  • For Panelized Form or for mounting of consigned chips, consult factory

GENERAL SPECIFICATIONS

  • ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces
  • PADS: hot-air solder leveled
  • PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
  • PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 ASTM B579-73 over 100μ [2.54μ] Ni per ASE AMS-QQ-N-290 or 10μ [0.25μ] Au
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
  • Will plug into standard PGA socket
Supplier's Site Datasheet

Technical Specifications

  Aries Electronics, Inc.
Product Category IC Interconnect Components
Product Name PLCC-to-PGA Adapter
Product Type Package Adapters / Converters
Socket Type PLCC
Mounting Through-Hole
Operating Temperature 105 C (221 F)
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