Aries Electronics, Inc. Series 35W000 SOWIC-to-DIP Adapter

FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011 GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN PLATING: Sn/Pb 93/7 per ASTM B 545 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.