Aries Electronics, Inc. EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Solder Tail Pins

FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high vibration environments The latch, when used as an ejector, removes DIP packages without pin damage GENERAL SPECIFICATIONS LATCH AND BODY: black UL-94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 6-FINGER COLLECT CONTACTS: BeCu per UNS C17200 ASTM B194-08 CONTACT PLATING: either 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min.Sn per ASTM B545 Type 1 or 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B Heavy 30µ [0.76µ] Au plating on contact also available CONTACT CURRENT RATING: 3 amps INSULATION RESISTANCE: 10,000 Mω at 500VDC WITHSTANDING VOLTAGE: 1000Vrms OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn plating; -67°F to 257°F [-55°C to 125°C] Au plating INSERTION FORCE: 67g/pin, based on 0.018 [0.46] dia. test lead WITHDRAWAL FORCE: 30g/pin, based on 0.018 [0.46] dia. test lead NORMAL FORCE: 45g/pin, based on 0.018 [0.46] dia. test lead MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.030 ±0.002 [0.76 ±0.05] dia.