Aries Electronics, Inc. EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Wire Wrap Pins

FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high-vibration environments The latch, when used as an ejector, removes DIP packages without pin damage GENERAL SPECIFICATIONS LATCH AND BODY: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 6-FINGER COLLECT CONTACTS: BeCu per UNS C17200 ASTM B194-08 CONTACT PLATING: 30µ [0.76µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B CONTACT CURRENT RATING: 3 amps INSULATION RESISTANCE: 10,000 Mω at 500VDC WITHSTANDING VOLTAGE: 1000Vrms OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn plating; -67°F to257°F [-55°C to 125°C] Au plating INSERTION FORCE: 67g/pin, based on 0.018 [0.46] dia. test lead WITHDRAWAL FORCE: 30g/pin, based on 0.018 [0.46] dia. test lead NORMAL FORCE: 45g/pin, based on 0.018 [0.46] dia. test lead MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.045 ±0.002 [1.15 ±0.05] dia.