Aries Electronics, Inc. Universal DIP ZIF Test Socket – Series X55X

FEATURES Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact Socket handle can be configured with closed contacts (on) when in the UP or DOWN position, and can be mounted on either the right or left side Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle GENERAL SPECIFICATIONS SOCKET BODY: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS) HANDLE: Stainless Steel HANDLE KNOB: Brass 360, 1/2-hard CONTACTS: BeCu 172 per QQ-C-533 –OR– Spinodal Alloy CONTACT PLATING: 50μ [1.27μ] min. Ni under-plate per QQ-N-290, over-plated with either 200μ [5.08μ] min. matte Sn per ASTM B545-97 –OR– 50μ [1.27μm] NiB CONTACT CURRENT RATING: 1 amp INSULATION RESISTANCE: 1000 Mω min. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC LIFE CYCLE: 25,000 to 50,000 cycles OPERATING TEMPERATURE: 221°F [105°C] Sn plating; 302°F [150°C] Au plating; 392°F [200°C] NiB plating RETENTION FORCE (closed): 55g/pin based on a 0.020 [0.51] dia. test lead ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long