Aries Electronics, Inc. PLCC-to-DIP Adapter – RoHS/WEEE-Compliant

FEATURES Converts PLCC packaged ICs-to-DIP footprints Ideal for prototyping and testing/evaluation Available with PLCC Sockets or PLCC Pads on top side For Panelized Form or for mounting of consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: 0.062 [1.58] FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPTIONAL PLCC SURFACE MOUNT SOCKET: UL 94V-0 PPS SOCKET CONTACTS: Phosphors Bronze CURRENT RATING: 1 amp OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard IC socket See Table for Pad Layout when mounting PLCC socket