Aries Electronics, Inc. SOIC-to-JEDEC TO Adapter

Description
FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
  • SOIC-to-JEDEC TO Adapter - Aries Electronics, Inc.
    Aries Electronics, Inc.
Datasheet
Description
FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
SOIC-to-JEDEC TO Adapter - - Aries Electronics, Inc.
Aries Electronics, Inc.
Bristol, PA, USA
SOIC-to-JEDEC TO Adapter
SOIC-to-JEDEC TO Adapter
FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

FEATURES

  • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board
  • For Panelized Form or for mounting of consigned chips, consult factory

GENERAL SPECIFICATIONS

  • ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides
  • MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Supplier's Site Datasheet

Technical Specifications

  Aries Electronics, Inc.
Product Category IC Interconnect Components
Product Name SOIC-to-JEDEC TO Adapter
Product Type Package Adapters / Converters
Socket Type SOIC
Mounting Through-Hole
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