Aries Electronics, Inc. Low-Profile DIP ZIF Socket – Series 526

FEATURES A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the ZIF DIP test socket A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal Test point openings provided to reach all pins GENERAL SPECIFICATIONS PLASTIC BODY: black UL 94V-0 glass-filled 4/6 Nylon CONTACTS: BeCu 172, spring-tempered CONTACT PLATING: “-10” 200µ [5.08µ] min. matte Sn per ASTM B545-97(2004) over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B; “-10TL” 200µ [5.08µ] min. 90/10 Sn/Pb per MIL-T-10727 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290; “-11” 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B – Consult factory for availability CAM: lightweight, strong, and rigid cast Zn OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn & Sn/Pb plating; -67°F to 257°F [-55°C to 125°C] Au plating CONTACT CURRENT RATING: 2 amps CONTACT RESISTANCE: 10 mω max. BREAKDOWN VOLTAGE: 1000VAC min. AVERAGE RETENTION FORCE (when closed): 110g/lead, based on 0.010 [0.25] dia. test lead SOCKET ACCEPTS: 0.008-0.014 [0.20-0.36] thick leads, 0.075-0.200 [1.91-5.08] long MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.035 ±0.002 [0.89 ±0.05] dia.