Aries Electronics, Inc. Fine Pitch Bump Adapters

FEATURES Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm Features raised connection pads up to 0.010 [0.25] Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly Can be manufactured for RoHS compliance GENERAL SPECIFICATIONS BOARD MATERIAL: 0.032 [0.813] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD TRACE WIDTH/SPACE: 0.003 [0.076] OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free MOUNTING CONSIDERATIONS Solders to existing PCB footprints for QFP's, TSSOPs, and many other fine pitch devices down to 0.4mm