FEATURES
Converts PLCC packaged ICs to DIP footprints
Ideal for prototyping and testing/evaluation
Available with PLCC sockets or PLCC pads on top side
For Panelized Form or for mounting of consigned ICs, consult factory
GENERAL SPECIFICATIONS
ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 is 200µ [5.08µ] per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
OPTIONAL PLCC SURFACE MOUNT SOCKET: UL 94V-0 PPS
SOCKET CONTACTS: Phosphor Bronze, Sn-plated
CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will plug into standard IC socket
See Table for Pad Layout when mounting PLCC socket
Aries Electronics, Inc.
Done
Datasheet
Description
FEATURES
Converts PLCC packaged ICs to DIP footprints
Ideal for prototyping and testing/evaluation
Available with PLCC sockets or PLCC pads on top side
For Panelized Form or for mounting of consigned ICs, consult factory
GENERAL SPECIFICATIONS
ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 is 200µ [5.08µ] per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
OPTIONAL PLCC SURFACE MOUNT SOCKET: UL 94V-0 PPS
SOCKET CONTACTS: Phosphor Bronze, Sn-plated
CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will plug into standard IC socket
See Table for Pad Layout when mounting PLCC socket
FEATURES
Converts PLCC packaged ICs to DIP footprints
Ideal for prototyping and testing/evaluation
Available with PLCC sockets or PLCC pads on top side
For Panelized Form or for mounting of consigned ICs, consult factory
GENERAL SPECIFICATIONS
ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 is 200µ [5.08µ] per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
OPTIONAL PLCC SURFACE MOUNT SOCKET: UL 94V-0 PPS
SOCKET CONTACTS: Phosphor Bronze, Sn-plated
CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will plug into standard IC socket
See Table for Pad Layout when mounting PLCC socket
FEATURES
Converts PLCC packaged ICs to DIP footprints
Ideal for prototyping and testing/evaluation
Available with PLCC sockets or PLCC pads on top side
For Panelized Form or for mounting of consigned ICs, consult factory
GENERAL SPECIFICATIONS
ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 is 200µ [5.08µ] per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B with 10µ [0.25µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B