Master Bond, Inc. Datasheets for Epoxy Adhesives
Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Epoxy Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Chemical resistant, two part epoxy, EP41S-5 has exemplary resistance to a wide array of chemicals, such as acids, bases, alcohols, fuels and many solvents, including methylene chloride. It is widely... | |
| Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60°F to... | |
| Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It... | |
| EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. | |
| EP21LVFL is a two part epoxy for bonding, sealing, coating and potting. It features convenient handling, high elongation, a low modulus and withstands thermal cycling and shock. | |
| EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume... | |
| EP21NDCL is an eye-catching system that is optically clear when mixed, even though Part A is translucent and Part B is light amber. It produces high strength, durable bonds which... | |
| EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| EP22ND has a high compressive strength, long working life and is readily machinable. | |
| EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of... | |
| EP30AO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained. | |
| EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. | |
| EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of... | |
| EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well... | |
| EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as... | |
| EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. | |
| EP40ND is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. It meets NASA low outgassing specifications and has a high elongation of... | |
| EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical... | |
| EP41S-5ND Black is a two part, NASA low outgassing rated epoxy, with outstanding chemical resistance to acids, bases, alcohols and fuels. | |
| EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically... | |
| EP4G-80 is a one component, low viscosity, graphite filled epoxy that meets NASA low outgassing requirements. | |
| EP51FL-1ND-2 is a two component, highly flexible epoxy resin system for high performance bonding, sealing and coating featuring a very rapid set up time and cure. | |
| EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. It is non-metallic system designed for heat sensitive electronic... | |
| EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. | |
| EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a... | |
| EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity... | |
| EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests... | |
| Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and... | |
| Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system... | |
| Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this... | |
| Featuring a silicon carbide filler, Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting. This specialty system can be used for a wide... | |
| Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding... | |
| Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is... | |
| Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases... | |
| Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable... | |
| For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system... | |
| Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear... | |
| Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in... | |
| Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. | |
| Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat... | |
| Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame... | |
| Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically... | |
| Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88... | |
| Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is... | |
| Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and... | |
| Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting. | |
| Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists... | |
| Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,... | |
| Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and... | |
| Master Bond EP126 withstands very high temperatures, up to +600°F, and has a glass transistion temperature of +240°C. This two component product features unique handling properties as Part A is... | |
| Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach. It is recommended when its exceptionally high Tg of 185-190°C is a critical... | |
| Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. | |
| Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. | |
| Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. | |
| Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. | |
| Master Bond EP21SC-1 is a two component epoxy system featuring truly exceptional abrasion resistance. This high performance compound utilizes silicon carbide as a filler material and can be used as... | |
| Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good... | |
| Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. | |
| Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation. | |
| Master Bond EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. This... | |
| Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. | |
| Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically... | |
| Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various... | |
| Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to... | |
| Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably... | |
| Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and... | |
| Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for... | |
| Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. | |
| Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. | |
| Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as... | |
| Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. | |
| Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. | |
| Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. | |
| Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be... | |
| Master Bond EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested and certified by one of... | |
| Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and... | |
| Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good... | |
| Master Bond EP51CC is a two component, fast setting epoxy with a color coding system where Part A is white and Part B is black. The two parts combine into... | |
| Master Bond EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion and a high Tg. | |
| Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature. | |
| Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. | |
| Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. | |
| Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. | |
| Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. | |
| Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration... | |
| Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has... | |
| Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is... | |
| Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... | |
| Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or... | |
| Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one... | |
| Master Bond Polymer Adhesive EP21FLV is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix... | |
| Master Bond Polymer Adhesive EP21LP is a two component, clear epoxy adhesive for general purpose bonding formulated to feature long pot life at room temperature and cure at room temperature... | |
| Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one... | |
| Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one... | |
| Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix... | |
| Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures... | |
| Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... | |
| Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated... | |
| Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with... | |
| Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily... | |
| Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated... | |
| Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily... | |
| Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... | |
| Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... | |
| Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... | |
| Master Bond Polymer Adhesive EP51AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... | |
| Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... | |
| Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly... | |
| Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to... | |
| Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can... | |
| Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electroni c/ structural applications. | |
| Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where... | |
| Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal... | |
| Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique... | |
| Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at... | |
| Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This... | |
| Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated... | |
| Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and... | |
| Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It is a one part, non mix... | |
| Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It feature remarkably long shelf life and... | |
| Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or... | |
| Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. | |
| Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. | |
| Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical... | |
| Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,... | |
| Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature... | |
| Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up... | |
| Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at... | |
| Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at... | |
| Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... | |
| Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60... | |
| Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to... | |
| Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... | |
| Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and... | |
| Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... | |
| Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. | |
| Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room... | |
| Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more... | |
| Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will... | |
| Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function... | |
| Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or... | |
| Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent... | |
| Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It... | |
| Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. | |
| Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low... | |
| Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well... | |
| Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It... | |
| Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines... | |
| Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system... | |
| Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated... | |
| Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more... | |
| Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or... | |
| Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. | |
| Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing... | |
| Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more... | |
| Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many... | |
| Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature... | |
| Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It... | |
| Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated... | |
| Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination... | |
| Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding... | |
| Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a very... | |
| Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a... | |
| Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... | |
| Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... | |
| Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does... | |
| Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and... | |
| Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an... | |
| Master Bond Polymer System EP3HT is a one component system featuring high shear strength, good temperature resistance along with a fast cure schedule. Typical curing schedules are 5-10 minutes at... | |
| Master Bond Polymer System EP3HTMed represents a breakthrough in epoxy adhesive technology combining the ease of use of a one part, no-mix, fast curing adhesive with high shear strength. This... | |
| Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. | |
| Master Bond Polymer System EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and adhesive/sealants with outstanding resistance to organic solvents including... | |
| Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance bonding, sealing, coating and encapsulating. EP41S-1 is formulated to cure at ambient temperatures... | |
| Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is... | |
| Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from... | |
| Master Bond Polymer System EP45HTMed is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the assembly of... | |
| Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is... | |
| Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,... | |
| Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,... | |
| Master Bond Polymer System EP62-1Med is a two component epoxy adhesive, sealant, coating, and encapsulant featuring outstanding temperature and chemical resistance. It has wide applicability for use in medical devices,... | |
| Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... | |
| Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... | |
| Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of... | |
| Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... | |
| Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film... | |
| Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid... | |
| Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to... | |
| Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for... | |
| Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation... | |
| Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure... | |
| Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. | |
| Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and coating. It is user friendly with a convenient one to one mix ratio... | |
| Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. | |
| Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. | |
| Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. | |
| Master Bond Supreme 70CN is a moderate viscosity, toughened epoxy for high performance bonding, sealing, coating and potting. | |
| Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and... | |
| Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... | |
| Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This adhesive allows for... | |
| Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. | |
| Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a... | |
| Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light,... | |
| Master Bond UV15TK is a new one component, high strength, medium viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... | |
| Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100%... | |
| Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... | |
| Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based... | |
| Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal... | |
| Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation... | |
| Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant... | |
| Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety... | |
| Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound... | |
| Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap... | |
| Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. | |
| Supreme 11HTND withstands thermal cycling, has high bond strength and excellent toughness. It has a paste consistency andis easy to apply. | |
| Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life. | |
| Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable... | |
| Supreme 18TC is a one component conductive epoxy adhesive featuring the same exceptional heat transfer capabilities as EP48TC. This thermal conductive and electrically insulative system meets NASA low outgassing specifications. | |
| Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. | |
| Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it... | |
| Supreme 42HT-2ND Black is a two part, non-flow epoxy for bonding, sealing and coating that meets NASA low outgassing requirements. | |
| Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative. | |
| Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold... | |
| Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range... | |
| Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,... | |
| Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety... | |
| UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation,... | |
| Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity... | |
| Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use,... | |
| With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix... | |
| With a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It... | |
| With convenient handling, EP21NDFG has a non-drip viscosity and a one to one mix ratio by weight or volume. It produces high strength, durable bonds which hold up well to... | |
| With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition... |