Master Bond, Inc. Fast Curing, High Temperature Resistant Epoxy EP65HT

Description
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT retains fast setup times even when mixed in relatively small masses. EP65HT normally will setup within 8-10 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths exceeding 2000 psi. Service temperature range is -60°F to +400°F. EP65HT offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries. The cure of this product is highly exothermic. It is recommended that the maximum quantity to be mixed at one time be limited by 20-25 grams.
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Description
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT retains fast setup times even when mixed in relatively small masses. EP65HT normally will setup within 8-10 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths exceeding 2000 psi. Service temperature range is -60°F to +400°F. EP65HT offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries. The cure of this product is highly exothermic. It is recommended that the maximum quantity to be mixed at one time be limited by 20-25 grams.
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Suppliers

Company
Product
Description
Supplier Links
Fast Curing, High Temperature Resistant Epoxy - EP65HT - Master Bond, Inc.
Hackensack, NJ, USA
Fast Curing, High Temperature Resistant Epoxy
EP65HT
Fast Curing, High Temperature Resistant Epoxy EP65HT
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT retains fast setup times even when mixed in relatively small masses. EP65HT normally will setup within 8-10 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths exceeding 2000 psi. Service temperature range is -60°F to +400°F. EP65HT offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries. The cure of this product is highly exothermic. It is recommended that the maximum quantity to be mixed at one time be limited by 20-25 grams.

Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT retains fast setup times even when mixed in relatively small masses. EP65HT normally will setup within 8-10 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths exceeding 2000 psi. Service temperature range is -60°F to +400°F. EP65HT offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries. The cure of this product is highly exothermic. It is recommended that the maximum quantity to be mixed at one time be limited by 20-25 grams.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP65HT
Product Name Fast Curing, High Temperature Resistant Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Composition Unfilled
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