Master Bond, Inc. Datasheets for Polyurethane Adhesives and Sealants

Polyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part systems.
Polyurethane Adhesives and Sealants: Learn more

Product Name Notes
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable...
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
USP Class VI Certified, Two Component Epoxy -- EP30Med Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
Two Component, Non-Drip Consistency Epoxy System -- EP30ND Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated...
Two Component, Room Temperature Curing Epoxy -- EP21ND Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Two Component, Highly Flexible Epoxy -- EP21TDC-4 Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Toughened Epoxy Compound -- EP21TDC-4HT Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Highly Flexible Two Part Epoxy -- EP21TDC-7 Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Transparent, Highly Flexible Epoxy Compound -- EP30D-10 Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It...
Two Part Epoxy Features High Electrical Conductivity -- EP30C Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well...
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7 Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It...
Cryogenically Serviceable Epoxy Urethane System -- EP30DP Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines...
One Component, Biocompatible UV Curable Adhesive -- UV10Med Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating...
One Component, UV and Heat Curable Epoxy -- UV15DC80 Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30...
USP Class VI, Flexible UV Curable Adhesive -- UV18Med Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2 UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it...