Master Bond, Inc. Datasheets for Polyurethane Adhesives and Sealants
Polyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part systems.
Polyurethane Adhesives and Sealants: Learn more
| Product Name | Notes |
|---|---|
| EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| EP21TDCAOHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one... | |
| Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one... | |
| Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... | |
| Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily... | |
| Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated... | |
| Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... | |
| Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to... | |
| Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... | |
| Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. | |
| Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room... | |
| Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It... | |
| Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well... | |
| Master Bond Polymer System EP30D-7 is a versatile two component flexible epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It... | |
| Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines... | |
| Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating... | |
| Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30... | |
| Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile... | |
| UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it... |