Master Bond, Inc. Two Component Polymer System EP21CLV

Description
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.
Request a Quote
Description
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Two Component Polymer System - EP21CLV - Master Bond, Inc.
Hackensack, NJ, USA
Two Component Polymer System
EP21CLV
Two Component Polymer System EP21CLV
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21CLV
Product Name Two Component Polymer System
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Composition Filled
Unlock Full Specs
to access all available technical data

Similar Products

B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation - FLM36 - Master Bond, Inc.
Specs
Cure / Technology Thermoset
Type / Form Pellets; Sheet or Film
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Low Outgassing, Optically Clear Two Component Epoxy - EP29LPSP - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
View Details
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity - Supreme 121AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
View Details
High Temperature Resistant, Thermally Conductive Epoxy - EP46HT-1AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
View Details