Master Bond, Inc. Datasheets for Laminating Adhesives and Composite Resins

Laminating adhesives and composite resins are cured using heat and/or heat and pressure.
Laminating Adhesives and Composite Resins: Learn more

Product Name Notes
Low Viscosity, Non-Yellowing Two Component Epoxy -- EP112LS EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases.
Low Viscosity, Two Component Epoxy with Low Exotherm -- EP21LVSP6 EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume...
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Thermally Conductive Epoxy Features Long Working Life -- EP29LPAO EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of...
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity...
One Component, Snap Cure, High Strength Epoxy -- EP3SP5FL Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is...
Quartz Filled Chemical Resistant Two Component Epoxy -- Supreme 45HTQ Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases...
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable...
Nanosilica Filled, Optically Clear Epoxy Adhesive -- EP113 Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing.
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100 Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat...
Two Component Flame Retardant FAR Approved Epoxy Adhesive -- EP90FR-V Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame...
Optically Clear, Low Viscosity Epoxy with a Long Open Time -- EP62-1LPSP Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and...
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good...
One Part Epoxy Adhesive for Underfill Applications -- EP3UF Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as...
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing -- MasterSil 153Med Master Bond MasterSil 153Med is a two component, paste silicone compound for high performance bonding and sealing. This is an addition cured system and does not require exposure to air...
Thermally Conductive Room temperature Curing Epoxy -- EP21AN Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has...
Two Component, Thermally Conductive -- EP21ANHT Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is...
Thermally Conductive, Dimensionally Stable Epoxy -- EP21AO Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile...
Thermally Conductive, Room temperature Curing Epoxy -- EP21AOHT Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or...
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2NV Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix...
Two Component, Room Temperature Curing Polysulfide -- EP21TPLV-NV Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures...
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4 Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated...
High Temperature Resistant, Two Component Epoxy -- EP30HT Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with...
USP Class VI Certified, Two Component Epoxy -- EP30Med Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33 Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Room Temperature Curing, Two Component Epoxy -- EP33LV Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
High Temperature Resistant, Toughened Epoxy -- EP125 Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can...
Low Viscosity Structural Epoxy Adhesive System -- EP112 Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The...
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where...
Room Temperature Curing Epoxy System -- EP21 Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or...
Acid Resistant, Two Component Epoxy -- EP21AR Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Two Component, Acid Resistant Coating/Liner -- EP21ARHT Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Radiopaque Two Component Epoxy Compound -- EP21BAS Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical...
Two Component Polymer System -- EP21CLV Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature...
High Temperature Resistant Two Component Epoxy -- EP21HT Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up...
Low Viscosity, Two Component Epoxy -- EP21LV Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at...
Two Part, Flexible, USP Class VI Epoxy System -- EP21LV3/5Med Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at...
Two Component, Room Temperature Curing Epoxy -- EP21ND Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Two Component, Highly Flexible Epoxy -- EP21TDC-4 Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Toughened Epoxy Compound -- EP21TDC-4HT Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Highly Flexible Two Part Epoxy -- EP21TDC-7 Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22 Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more...
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30 Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly...
Low Viscosity, Two Component Epoxy -- EP30-1 Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or...
Low Outgassing Two Component Epoxy -- EP30-2 Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly...
Two Component, Thermally Resistant Epoxy -- EP30-3 Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent...
Transparent, Highly Flexible Epoxy Compound -- EP30D-10 Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It...
Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties.
Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low...
Thermally Conductive, Low Viscosity Epoxy -- EP30AO Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at...
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7 Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It...
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines...
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system...
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated...
Two Component Optically Clear Epoxy Compound -- EP30HV Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or...
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting.
NASA Low Outgassing Approved Epoxy System -- EP30LTE-LO Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing...
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more...
Quartz Filled, Two Component Epoxy -- EP30QF Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting formulated to cure at room temperature or more rapidly at...
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31 Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many...
Room Temperature Curing, Two Component Epoxy System -- EP34 Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Two Component, Room Temperature Curing Epoxy -- EP34AN Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It...
Two Component, Heat Resistant Epoxy -- EP46HT-1 Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is...
Fast Curing Surface Mount Adhesive -- Supreme 3HTND-1SM Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for...
One Component, Optically Clear UV Curable System -- UV15-7LRI Master Bond Polymer System UV 15-7LRI is a new one component, optically clear, non-yellowing UV curable polymer system for high performance adhesives, sealants and coatings. It is 100% reactive and...
One Part, Optically Clear UV Curable System -- UV15-42C Master Bond Polymer System UV15-42C is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
High Strength, Non-Yellowing UV Curable -- UV15-7NV Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and...
One Component UV Curable Compound -- UV15-7SP4 Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80°F to +250°F. It is 100% reactive,...
UV Curable Compound UV15-7TK1ANV Features Paste Consistency -- UV15-7TK1ANV Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
One Component, UV Curable Glob Top Compound -- UV15X-2GT Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well...
One Component, High Viscosity UV Curable Compound -- UV15X-5 Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be...
One Component Low Viscosity, Optically Clear UV Curable -- UV19 Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based...
One Component, Highly Flexible UV Curable Urethane -- UV21 Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high...
One Component, UV Curable, Nanosilica Reinforced Epoxy -- UV22 Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation...
One Component, UV Curable Adhesive System -- UV10 Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a...
One Component, Biocompatible UV Curable Adhesive -- UV10Med Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating...
One Component, High Viscosity UV Curable Polymer -- UV11-3 Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure...
High Strength UV Curable Adhesive -- UV15 Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, UV and Heat Curable Epoxy -- UV15DC80 Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30...
One Part, Flexiblized UV Curable System -- UV15FL Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties.
One Component, Low Viscosity UV Curable System -- UV15LV Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a...
One Part UV Curable System Resists High Temperatures -- UV15TK Master Bond UV15TK is a new one component, high strength, medium viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2 Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100%...
High Strength, UV Curable Epoxy System -- UV16 Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Part, Water & Chemical Resistant Curable System -- UV18 Master Bond UV18 is a new one component, high strength UV curable chemically and water resistant polymer system for coating, sealing, & bonding with exceptionally high performance properties. It is...
USP Class VI, Flexible UV Curable Adhesive -- UV18Med Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
High Strength, Chemically Resistant UV Curable System -- UV18S Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
Thermally Conductive One Part Epoxy for Die Attach -- Supreme 3HTND-2DA Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C.
Heat Resistant, NASA Low Outgassing Epoxy Adhesive -- Supreme 12AOHT-LO Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable...
Thermally Stable, NASA Low Outgassing Two Part Epoxy -- EP30-3LO With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix...
Toughened, Optically Clear Two Component Epoxy -- EP38CL With a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It...
High Temperature Resistant, Thermally Conductive Epoxy -- EP46HT-1AO With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition...