Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of thermal cycling. This fast curing system has a paste consistency that flows slightly while curing. Supreme 3HTND-2CCM passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | Supreme 3HTND-2CCM |
| Product Name | Toughened One Part Epoxy for Chip Coating Applications |
| Cure / Technology | Thermoset; Single Component |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Unfilled |
