Master Bond, Inc. Thermally Conductive Room temperature Curing Epoxy EP21AN

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.